The Global Shift in Advanced Semiconductor Manufacturing: High Bandwidth Memory (HBM), Through-Silicon Via (TSV) Integration, and the Surge in DRAM Pricing

Global semiconductor demand is currently driven by AI infrastructure, with High Bandwidth Memory (HBM) emerging as a core enabler of next-generation computing systems. Production is increasingly shifting toward advanced packaging technologies like TSV, creating new yield and process challenges. While manufacturing remains concentrated in East Asia, companies are diversifying supply chains through dual sourcing, inventory buffers, and regional hubs. Looking ahead, value creation will center on advanced packaging, chiplet architectures, and memory-led system innovation across global markets.